Reliable Thermal Design

For cyber physical systems designed for computationally intensive tasks (such as data streaming, machine vision), heat dissipation of the main processing units has become one of the limiting factors in miniaturization. One of the biggest concerns of designers is to reduce power that is continuously increasing due to increasing data bandwidths. The increasing power results in increasing temperature of the unit. If the heat is not appropriately led out of the device, thermal-mechanical stresses may lead at first to unreliable operation, later to probable system failure.

The main concerns of reliable thermal design are software, printed circuit board layout, as well as the mechanical structure of the products.

The service offered by BME provides efficient help for innovative hardware designers to design reliable products and avoid thermally induced failures throughout the product’s lifetime.

The offer covers the following services:

1. Know-how and consultation of optimal thermal design, mechanical construction, PCB layout design and heat dissipation techniques
2. Optimal design support by numerical analysis, FEM simulation
3. Non-destructive analysis of heat paths of critical components by thermal transient measurements
4. Thermal imaging and hot-spot analysis

Typical use cases

The above service can be applied for each design problems where high computational capacity and small form factor should met at the same time, such as edge computing units in harsh environments, machine vision devices, high bandwidth data streamers.